Filter
Top Products
ii
Manual Revision History
Version Revision Date Update Summary
1 001 February 2000 First Version
2 001 August 2000 GND and VDD pins marked as type “PWR” in tables 2.2 and 20.1.
Modified TESTMODE (pin 74) definition.
Removal of extra "
TM
" and "
®
" trade-markings throughout.
New BSIO Introduction (Secs 6.1, 6.2)
Extensive DMAC usage procedures added (Sec 8) and section 17.4 deleted.
Updated MPC Configuration for Memory Area 3 (Sec 11)
New Note 1 added in Section 14.6.2
Updated Address Map info in Section 19.
IO Cell DC Characteristics added to Section 20.
3 001 November 2001 Change of company identity from Mitel Semiconductor to Zarlink
Semiconductor throughout.
Revised values for UTC Error Budget figures (Sec 15.3).
Figures 1.2 and 14.2 amended. Section 14.3.1 amended.
"Trademarks" and "Document Conventions" sections added.
Linked Cross-references to Sections, Figures and Tables added throughout.
3 002 January 2002 Document reformatted to US "Letter" size. Now 214 pages instead of ~300.
Page numbers reformatted to show continuous page-numbering.
Fig 14.4 updated to show revised TCXO connection to RF Front-end device.
Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright © 2002, Zarlink Semiconductor Inc. All Rights Reserved.
Information relating to products and services furnished herein by Zarlink Semiconductor Inc. trading as Zarlink Semiconductor or
its subsidiaries (collectively “Zarlink”) is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in
this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any
infringement of patents or other intellectual property rights owned by third parties which may result from such application or use.
Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under
patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of
products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished
goods or services may infringe patents or other intellectual property rights owned by Zarlink.
This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or
reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products
or services concerned. The products, their specifications, services and other information appearing in this publication are subject
to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or
suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not
constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s
responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any
publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all
functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in
significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink Semiconductor’s
conditions of sale, which are available on request.
TECHNICAL DOCUMENTATION - NOT FOR RESALE, PRINTED IN THE UNITED KINGDOM.
DOCUMENT NUMBER: DM5280 003 January 2002