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ATCA-C110/1G Installation and Use Manual
95
REVIEW COPY
C Thermal Validation
Thermal Requirements
Board component temperatures are affected by ambient temperature, airflow, board electrical
operation and software operation. In order to evaluate the thermal performance of a circuit
board assembly, it is necessary to test the board under actual operating conditions. The
operating conditions vary depending on system design.
While Embedded Communications Computing performs thermal analysis in a representative
system to verify operation within specified ranges (see Appendix B, Specifications), you should
evaluate the thermal performance of the board in your application. Contact Motorola for current
information on the thermal validation of the ATCA-C110/1G.
Thermally Significant Components
The following table summarizes components that exhibit significant temperature rises. These
components should be monitored in order to assess thermal performance. The table also
supplies the component reference designator and the maximum allowable operating
temperature.
Versions of the board that are not fully populated may not contain some of these components.
The preferred measurement location for a component may be junction, case, or air as
specified in the table. Junction temperature refers to the temperature measured by an on-chip
thermal device. Case temperature refers to the temperature at the top, center surface of the
component. Air temperature refers to the ambient temperature near the component.
Table C-1. Thermally Significant Components
Component identifier Reference designator Thermal dissipation
power (TDP)
Maximum allowable
temperature
CPU-PowerQUICC III™
(MPC8540)
U45 10.1W Die-Junction
temperature = 105ºC
Memory (9 devices)
SODIMM (9 devices)
U142, U143, U144, U145,
U146, U151, U152, U153,
U154, S3
0.5W per Memory device
4.5W for SODIMM
Max. Case
Temperature = 70ºC
Min. Case Temperature = 0ºC
Ethernet Switch (on FIM) U14 16W Junction Temperature = 125ºC
Power Brick U103 20W Max. Junction
temperature = 110ºC
PCI-Express Switch (on
FIM)
U17 8.37W Case Temperature = 75ºC
Hold-up Capacitor CE9902 NA Case Temperature = 105ºC