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9 SHIPPING and HANDLING
88 Copernicus GPS Receiver
Shipping and Handling Guidelines
Handling
The Copernicus GPS module is shipped in tape and reel for use with an automated
surface mount machine. This is a lead-free module with silver plating. Do not allow
bodily fluids or lotions to come in contact with the bottom of the module.
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WARNING – The Copernicus GPS module is packed according to ANSI/EIA-481-B and J-
STD-033A. All of the handling and precaution procedures must be followed. Deviation
from following handling procedures and precautions voids the warranty.
Shipment
The reel of Copernicus GPS modules is packed in a hermetically sealed moisture
barrier bag (DryPac) then placed in an individual carton. Handle with care to avoid
breaking the moisture barrier.
Storage
The shelf life for the sealed DryPac is 12 months and it must be stored at <40 °C and
<90% relative humidity.
Moisture Indicator
A moisture indicator is packed individually in each DryPac to monitor the
environment. All five indicating spots are shown blue from the factory. If the
indicator shows pink, follow the instructions printed on the indicator and bake as
necessary. See Baking Procedure, page 90 for baking instructions.
Floor Life
The reel of Copernicus GPS modules is vacuum sealed in a moisture barrier bag
(DryPac). Once the bag is opened, moisture will bond with the modules. In a
production floor environment, an open reel needs to be processed within 72 hours,
unless it is kept in a nitrogen purged dry chamber. If the moisture indicator has
changed to pink, follow the baking instructions printed on the moisture barrier.
The Copernicus GPS is a lead free component for RoHS compliance. This unit is also
plated with immersion silver for better solderability. The silver may tarnish over time
and show yellow in color, but tarnish should not affect the solderability.
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WARNING – Operators should not touch the bottom silver solder pads by hand or with
contaminated gloves. No hand lotion or regular chlorinated faucet water can be in
contact with this module before soldering.