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Copernicus GPS Receiver 89
SHIPPING and HANDLING 9
Moisture Precondition
Precautions must be taken to minimize the effects of the reflow thermal stress on the
module. Plastic molding materials for integrated circuit encapsulation are
hygroscopic and absorb moisture dependent on the time and the environment.
Absorbed moisture will vaporize during the rapid heating of the solder reflow
process, generating pressure to all the interface areas in the package, followed by
swelling, delamination, and even cracking of the plastic. Components that do not
exhibit external cracking can have internal delamination or cracking which affects
yield and reliability.
Figure 9.1 Moisture Precondition Label