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ATCA-C110/1G Installation and Use Manual
Appendix C Thermal Validation
96
REVIEW COPY
Component Temperature Measurement
The following sections outline general temperature measurement methods. For the specific
types of measurements required for thermal evaluation of this board, see Table C-1 on page 95.
Preparation
We recommend 40 AWG (American Wire Gauge) thermocouples for all thermal measurements.
Larger gauge thermocouples can wick heat away from the components and disturb air flowing
past the board.
Allow the board to reach thermal equilibrium before taking measurements. Most circuit boards
will reach thermal equilibrium within 30 minutes. After the warm up period, monitor a small
number of components over time to assure that equilibrium has been reached.
Measuring Junction Temperature
There is an independent temperature sensor to measure inlet air temperature. Both sensors are
monitored by the IPMC and temperature can be read over IPMI. In addition the IPMC can also
monitor the temperature of the power brick.
For instructions on measuring temperatures using the onboard device, refer to the
ATCA-C110/1G IPMI Preliminary Reference Manual and to the component manufacturer’s
documentation listed in Appendix D, Related Documentation.
Measuring Case Temperature
Measure the case temperature at the center of the top of the component. Make sure there is
good thermal contact between the thermocouple junction and the component. We recommend
you use a thermally conductive adhesive such as Loctite 384.
PCI-PCI-Express Bridge U17 2.5W Case Temperature = 0ºC
BCM Phys U1, U2
U121, U122
0.5W for devices near
front panel
0.85W for devices near
backplane connectors
Junction Temperature = 125ºC
SATA Mux (on FIM)
and Fabric MUX (1+2
devices on main board)
U124
U125
2.1W Junction Temperature = 105ºC
Management Power
Brick
U129 0.75W Junction Temperature = 120ºC
Table C-1. Thermally Significant Components
Component identifier Reference designator Thermal dissipation
power (TDP)
Maximum allowable
temperature