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PACKAGE INFORMATION
PE-SON1612-6-0510
Power Dissipation (SON1612-6)
This specification is at mounted on board.
Power Dissipation (P
D) depends on conditions of mounting on board. This specification is based on the
measurement at the condition below:
Measurement Conditions
Standard Land Pattern
Environment Mounting on Board (Wind velocity=0m/s)
Board Material Glass cloth epoxy plactic (Double sided)
Board Dimensions
40mm × 40mm × 1.6mm
Copper Ratio Top side : Approx. 50%, Back side : Approx.50%
Through-hole
φ0.5mm × 24pcs
Measurement Result
(Topt=25°C,Tjmax=125°C)
Standard Land Pattern
Power Dissipation 500mW
Thermal Resistance
θja=(125−25°C)/0.5W=200°C/W
0 50 10025 75 85 125 150
Ambient Temperature (°C)
0
200
100
300
400
600
500
Power Dissipation P
D
(mW)
On Board
40
39
39
27
40
27
Power Dissipation Measurement Board Pattern
IC Mount Area Unit : mm
RECOMMENDED LAND PATTERN
0.50.28
0.450.45
(Unit: mm)