Filter
Top Products
PACKAGE INFORMATION
PE-SC-82AB-0512
POWER DISSIPATION (SC-82AB)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
Standard Land Pattern
Environment Mounting on Board (Wind velocity=0m/s)
Board Material Glass cloth epoxy plactic (Double sided)
Board Dimensions
40mm × 40mm × 1.6mm
Copper Ratio Top side : Approx. 50% , Back side : Approx. 50%
Through-hole
φ0.5mm × 44pcs
Measurement Result
(Topt=25°C,Tjmax=125°C)
Standard Land Pattern Free Air
Power Dissipation 380mW 150mW
Thermal Resistance
θja=(125−25°C)/0.38W=263°C/W 667°C/W
0 50 10025 75 85 125 150
Ambient Temperature (°C)
0
200
100
300
400
150
380
500
600
Power Dissipation P
D
(mW)
On Board
Free Air
40
40
Power Dissipation Measurement Board Pattern
IC Mount Area (Unit : mm)
RECOMMENDED LAND PATTERN
0.8
0.6
0.65
0.650.65
1.9
0.6
0.8
0.8
0.6 0.6
0.8
0.8
(Unit: mm)