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PACKAGE INFORMATION
PE-SOT-23-3-0510
POWER DISSIPATION (SOT-23-3)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
(Power Dissipation (SOT-23-3) is substitution of SOT-23-6.)
Measurement Conditions
Standard Land Pattern
Environment Mounting on Board (Wind velocity=0m/s)
Board Material Glass cloth epoxy plactic (Double sided)
Board Dimensions
40mm × 40mm × 1.6mm
Copper Ratio Top side : Approx. 50% , Back side : Approx. 50%
Through-hole
φ0.5mm × 44pcs
Measurement Result
(Topt=25°C,Tjmax=125°C)
Standard Land Pattern Free Air
Power Dissipation 420mW 250mW
Thermal Resistance
θja=(125−25°C)/0.42W=263°C/W 400°C/W
0 50 10025 75 85 125 150
Ambient Temperature (°C)
0
200
100
300
400
250
420
500
600
Power Dissipation P
D
(mW)
On Board
Free Air
40
40
Power Dissipation Measurement Board Pattern
IC Mount Area Unit : mm
RECOMMENDED LAND PATTERN (SOT-23-3)
0.7 MAX.
0.95
0.95
1.9
2.4
1.0
(Unit: mm)