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PACKAGE INFORMATION
PE-SOT-89-071210
POWER DISSIPATION (SOT-89)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
Standard Land Pattern
Environment Mounting on Board (Wind velocity=0m/s)
Board Material Glass cloth epoxy plastic (Double sided)
Board Dimensions
50mm
× 50mm × 1.6mm
Copper Ratio Top side : Approx. 10% , Back side : Approx. 100%
Through-hole -
Measurement Result (Topt=25°C,Tjmax=125°C)
Standard Land Pattern Free Air
Power Dissipation 900mW 500mW
Thermal Resistance
θja=(125−25°C)/0.9W=111°C/W 200°C/W
0 50 10025 75 125 150
Ambient Temperature (°C)
0
250
500
900
750
1000
Power Dissipation P
D
(mW)
On Board
Free Air
50
50
Power Dissipation Measurement Board Pattern
IC Mount Area (Unit : mm)
RECOMMENDED LAND PATTERN (SOT-89)
3.0
45°
0.71.5
1.5
1.5
1.0
1.0
1.0
2.0
(Unit : mm)