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ASUS P2V User’s Manual 17
III. INST ALLATION
System Memory
2. System Memory (DIMM)
This motherboard uses only Dual Inline Memory Modules (DIMMs). Three sockets
are available for 3.3Volt (power level) unbuffered Synchronous Dynamic Random
Access Memory (SDRAM) of either 8, 16, 32, 64, 128 or 256MB to form a memory
size between 8MB to 768MB. One side (with memory chips) of the DIMM takes up
one row on the motherboard.
To utilize the chipset’s Error Checking and Correction (ECC) feature, you must use a
DIMM module with 9 chips per side (standard 8 chips/side + 1 ECC chip) and make
the proper settings through “Chipset Features Setup” in IV. BIOS SOFTWARE.
Memory speed setup is recommended through SDRAM Configuration under “Chipset
Features Setup”.
IMPORTANT (see General DIMM Notes below)
• SDRAMs used must be compatible with the current Intel PC100 SDRAM
specification.
Install memory in any combination as follows:
DIMM Location 168-pin DIMM Total Memory
Socket 1 (Rows 0&1) SDRAM 8, 16, 32, 64, 128, 256MB x1
Socket 2 (Rows 2&3) SDRAM 8, 16, 32, 64, 128, 256MB x1
Socket 3 (Rows 4&5) SDRAM 8, 16, 32, 64, 128, 256MB x1
Total System Memory (Max 768MB) =
NOTES
• At the time this User’s Manual was written, 256MB DIMMs are only available as
registered memory.
• DIMMs that have more than 18 chips are not supported on this motherboard.
• For the system CPU bus to operate 100MHz, use only PC100-compliant DIMMs.
When this motherboard operates at 100MHz, most system will not even boot if non-
compliant modules are used because of the strict timing issues involved under these
speeds. If your DIMMs are not PC100-compliant, set the CPU bus frequency to
66MHz for system stability.
• ASUS motherboards support SPD (Serial Presence Detect) DIMMs. This is the
memory of choice for best performance vs. stability.
• SDRAM chips are generally thinner with higher pin density than EDO (Extended
Data Output) chips.
• BIOS shows SDRAM memory on bootup screen.
• Single-sided DIMMs come in 16, 32, 64,128MB; double-sided come in 32, 64, 128,
256MB.
III. INSTALLATION