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1. System Gates include 20%-30% of CLBs used as RAMs.
2. Each slice comprises two 4-input logic function generators (LUTs), two storage elements,
wide-function multiplexers, and carry logic.
3. Integrated in the DSP48A slices (Advanced Multiply Accumulate element).
4. Temperature Range Automotive I (T
j
= -40°C to +100°C); Automotive Q (T
j
= -40°C to +125°C).
Notes:
XA3S200A
Spartan-3A Spartan-3A DSP
XA3S400A XA3S700A XA3S1400A XA3SD1800A
Part Number
1,792 3,5845,888 11,264 16,640
200K 400K 700K 1400K 1800K
4,032 8,064 13,248 25,344 37,440Logic Cells
3,584 7,168 11,776 22,528 33,280CLB Flip-Flops
16 20 20 32 84
288 360 360 576 1,512
4488 8
195 311 372 375 519
90 142 165 165 227
LVTTL, LVCMOS33, LVCMOS25, LVCMOS18, LVCMOS15, LVCMOS12, HSTL15
Class I, HSTL15 Class III, HSTL18 Class I, HSTL18 Class II, HSTL18 Class III,
PCI 3.3V 32/64bit 33MHz, PCI-X 3.3V, SSTL3 Class I, SSTL3 Class II, SSTL2
Class I, SSTL2 Class II, SSTL18 Class I, SSTL18 Class II, Bus LVDS, LVDS25 & 33,
LVPECL25 & 33, Mini-LVDS25 & 33, RSDS25 & 33, TMDS25 & 33, PPDS25 & 33
Block RAM Blocks
Total Block RAM (Kbits)
Digital Clock Managers (DCM)
Maximum Single Ended I/Os
Maximum Differential I/O Pairs
I/O Standards Supported
XA3SD3400A
23,872
3400K
53,712
47,744
126
2,268
8
469
213
28 56 92 176 260Maximum Distributed RAM (Kbits) 373
Slices
(2)
Logic Resources
Memory Resources
Clock Resources
I/O Resources
195FTG256 17 x 17 mm 195
FGG400 21 x 21 mm
311 311
FGG484 23 x 23 mm
372 375
FGG676 27 x 27 mm 519 469
CSG484 19 x 19 mm 309 309
System Gates
(1)
Package Area Maximum User I/Os
16 20 20 32 84
(3)
Dedicated Multipliers
———— 84
DSP48A Slices
Yes Yes Yes Yes Yes
Device DNA Security
I, Q I, Q I, Q I, Q I, Q
Temperature Range
(4)
-4 -4 -4 -4 -4
Speed Grade
126
(3)
126
Yes
I
-4
Yes Yes Yes Yes Yes
RoHS (Pb-free)
Yes
No No No No No
XA Released
No
1.2 1.9 2.7 4.88.2
Configuration Memory Bits (Mbits)
11.7
Embedded Hard
IP Resources
Configuration
Miscellaneous
FGA Packages (FT): wire-bond fine-pitch thin BGA (1.0 mm ball spacing)
Chip Scale Packages (CS): wire-bond chip-scale BGA (0.8 mm ball spacing)
FGA Packages (FG): wire-bond fine-pitch BGA (1.0 mm ball spacing)
FPGAs
1. Temperature Range Automotive I (T
a
= -40°C to +85°C); Automotive Q (T
a
= -40°C to +105°C with T
j
maximum = +125°C).
2. Area dimensions for lead-frame products are inclusive of the leads.
Notes:
Part Number
Global Clocks
Product Term Clocks per Function Block
Maximum I/O
Input Voltage Compatible (V)
Output Voltage Compatible (V)
Min. pin-to-pin Logic Delay (ns)
Automotive I Speed Grades
Product terms per Macrocell
Macrocells
Logic Resources
I/O Resources
Clock Resources
Speed Grades
Miscellaneous
Automotive Q Speed Grades
Temperature Grades
(1)
RoHS (Pb-free)
XA Released
XA9500XL Family
XA9536XL
90
800
36
3
18
34
2.5/3.3/5
2.5/3.3
15.5
-15
-15
XA9572XL
90
1,600
72
3
18
72
2.5/3.3/5
2.5/3.3
15.5
-15
-15
XA95144XL
90
3,200
144
3
18
117
2.5/3.3/5
2.5/3.3
15.5
-15
-15
I, Q I, Q I
Yes Ye s Yes
Yes Ye s Yes
System Gates
XA2C32A
CoolRunner-II Family
XA2C64A XA2C128 XA2C256 XA2C384
56 56 56 56 56
750 1,500 3,000 6,000 9,000
32 64 128 256 384
33333
16 16 16 16 16
33 64 100 118 118
1.5/1.8/2.5/3.3 1.5/1.8/2.5/3.3 1.5/1.8/2.5/3.3 1.5/1.8/2.5/3.3 1.5/1.8/2.5/3.3
1.5/1.8/2.5/3.3 1.5/1.8/2.5/3.3 1.5/1.8/2.5/3.3 1.5/1.8/2.5/3.3 1.5/1.8/2.5/3.3
5.5 6.7 7.0 7.0 9.2
-6 -7 -7 -7 -10
-7 -8 -8 -8 -11
I, Q I, Q I, Q I, Q I, Q
Yes Yes Yes Yes Yes
Yes Yes Yes Yes Yes
VQG44 12 x 12 mm
VQG64 12 x 12 mm
VQG100 16 x 16 mm
CPG132 8 x 8 mm
CSG144 12 x 12 mm
TQG144 22 x 22 mm
TQG100 16 x 16 mm
34
34
52
72
117
33 33
64 80 80
100
118 118
Package Area
(2)
Maximum User I/Os
VQFP Packages (VQ): very thin QFP (0.5 mm lead spacing)
TQFP Packages (TQ): thin QFP (0.5 mm lead spacing)
Chip Scale Packages (CP): wire-bond chip-scale BGA (0.5 mm ball spacing)
Chip Scale Packages (CS): wire-bond chip-scale BGA (0.8 mm ball spacing)
CPLDs
Dedicated Automotive Product Line
Choose from our wide range of pin-compatible AEC-Q100
qualified products in various densities and packages suited
for automotive applications.
Offering extreme flexibility and reliability, our dedicated
XA products are at the heart of innovation.
Auto.Brochure_Final.qxd 12/19/07 9:19 AM Page 15