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18 Chapter 1
Hardware Specifications and Configurations
Processor
North Bridge
Item Specification
CPU AMD CPU S1g2 Processor (Griffin Series - Turion / Sempron);
HT3 (1.2~2.6 GT/s) (Bandwidth: 9.6GB/S to 20.8GB/s)
Type 1.8GHZ~2.3GHZ
CPU package AMD 638 pin Micro-PGA
Features
• Hyper Transport 3.0 Technology: Designed to support HT
Gen3 speeds from 1.2GHZ to 2.6GHZ.
• 64-bit or 128-bit DDR2 Memory Interface: Two independent
64-bit DDR2 channels.
• Split Power Planes: Separate power planes provided for each
CPU core and on die Northbridge
• Up to 2 processor cores per die, Up to 1MB L2 cache per die.
• Each CPU core supports up to 8 P-states: P0 (Highest
performance) and P7
CPU Power
• VDD0, VDD1 set according to the respective P-state control
when core VDD are isolated and VDD set according to the
CPU core in the highest performance P-state when VDD is
common.
• CPU_VDDNB; VLDT 1.2V_HT; VDD I/O 1.8VSUS; CPU
Memory Interface
Item Specification
Type AMD RS780M (North Bridge)
Package FCBGA 528-pin
Features
• CPU Hyper Transport Interface: Support 16-bit up/down Hyper
Transport 3.0 interface up to 5.2GT/S.
• PCI Express Interface: Support PCI-E GEN2; Optimized peer
to peer and general purpose link performance; Highly flexible
PCI Express implementation to suit a variety of platform needs.
• A-Link Express II interface: one x4 A-Link Express II Interface
for connection
Power 1.1V, 1.2V, 1.8V, 3.3V